Ball transferring method and apparatus

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United States of America Patent

SERIAL NO

11906388

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily arranged balls or alternatively the temporarily arranged balls are sucked, so as to remove excess balls other than balls that have been exactly sucked onto the ball arrangement region. Cooperation with application of fine vibration to the carrier board makes the removal of the excess balls more efficient.

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Patent Owner(s)

Patent OwnerAddress
NIPPON STEEL MATERIALS CO LTDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashino, Eiji Chiba, JP 18 155
Shimokawa, Kenji Chiba, JP 20 197
Tatsumi, Kohei Chiba, JP 36 283

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