Multilayer Printed Circuit Board
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United States of America Patent
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N/A
Issued Date -
Feb 7, 2008
app pub date -
Apr 27, 2005
filing date -
Apr 27, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A multilayer printed circuit board can be used in high-frequency applications, is not easily affected by environmental changes, and has stable dielectric characteristics. A multilayer printed circuit board suitable for use in the high-frequency range includes at least two printed wiring sheets laminated with an interlayer bonding member therebetween. At least one of the at least two printed wiring sheets includes an insulating film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the insulating film, and a metal wiring layer disposed on the adhesive layer. The interlayer bonding member contains a thermoplastic polyimide.
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