Component Provided With Bracket
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Jun 3, 2005
filing date -
Jul 8, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
It is an object to provide a component provided with a bracket, in which soldering deficiencies seldom occur when soldering a bracket that has a bead to the component body, and moreover, in which plating liquid does not remain when plating is carried out. And in order to achieve this object, in a component provided with a bracket in which a bracket 2 having a bead 3 formed thereon is joined [to the component body 1] such that an end portion 3a of the bead 3 faces the component body 1, a hole 6 is provided penetrating the end portion 3a of the bead 3, and a cavity portion 7 defined by the bracket 2 and the component body 1 is made open to outside through the hole 6.
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