Vibration damping material of polyamides and mercaptobenzoimidazoles
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United States of America Patent
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Issued Date -
Jan 31, 2008
app pub date -
Jul 24, 2007
filing date -
Jul 25, 2006
priority date (Note) -
Abandoned
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Abstract
The polyamide resin composition of the present invention is useful as a sound dampening material and includes (1) 30-97 wt % polyamide selected from (a) crystalline polyamide, (b) amorphous polyamide, or a mixture of (a) and (b), and (2) 1-30 wt % of a mercaptobenzoimidazole The polyamide resin composition of the present invention can further include a plasticizer or an inorganic filler.
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