Polyimide composite flexible board and its preparation field of the invention
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United States of America Patent
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Issued Date -
Jan 31, 2008
app pub date -
Jan 17, 2007
filing date -
Jul 26, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids each having a glass transition temperature of from 280 to 300.degree. C., from 300 to 350.degree. C., and from 190 to 280.degree. C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with a metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.
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