CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME
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United States of America Patent
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N/A
Issued Date -
Jan 31, 2008
app pub date -
Dec 27, 2006
filing date -
Jul 28, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A digital camera module (10) includes a chip package (20) and a lens module (50) mounted to the chip package. The package includes a carrier (21), a chip (23), a plurality of wires (24), an adhesive (26) and a cover (28). The carrier has a cavity (213) defined therein, an opening defined in a top surface, and a plurality of top contacts (215) arranged on the top surface around the opening. The chip is received in the cavity, and includes an active area (231) and a plurality of pads (233) disposed on a top surface thereof. The wires electrically connect each of the pads to a corresponding top contact of the carrier. The adhesive is applied to a peripheral circumference of the top surface of the chip around the active area. The cover is adhered to the adhesive, and encloses the active area of the chip cooperatively with the adhesive.
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