PIPING DESIGN FOR HIGH DENSITY PLASMA PROCESS CHAMBER
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United States of America Patent
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Issued Date -
Jan 31, 2008
app pub date -
Mar 28, 2007
filing date -
Jul 27, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention discloses a piping design for a high density plasma process chamber, wherein an extra pipe is added to between a process chamber and a mass flow controller, and the extra pipe together with a pump is used to drain out the gas, which cannot be monitored by the mass flow controller and survives in a gas injection pipe, lest the remaining gas pollute the deposited film or react with the process gas to induce an explosion in the succeeding deposition process.
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