POLYAMIDE MOULDING COMPOUND AND USE THEREOF
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United States of America Patent
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Issued Date -
Jan 24, 2008
app pub date -
Jul 10, 2007
filing date -
Jul 11, 2006
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Abandoned
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Abstract
The present invention relates to polyamide moulding compounds which have very low distortion with good mechanical properties. This is achieved by a combination of transparent polyamide with fibrous reinforcing materials and also particulate fillers. The moulding compounds according to the invention are used for the production of any moulded articles, semi-finished products or finished products.
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