Method and Apparatus for the Application of Powder Material to Substrates
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United States of America Patent
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Issued Date -
Jan 24, 2008
app pub date -
Dec 30, 2004
filing date -
Dec 30, 2003
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Abandoned
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Abstract
Apparatuses (201) and methods for electrostatically applying a powder material to substrates are described. A plurality of platens (202, 203) are provided, each arranged to hold a plurality of substrates such as solid dosage forms (101, 111). Each platen (202, 203) is driven around an endless path and passes through a loading region (FIGS. 3, 4) in which substrates are loaded onto the platens (202, 203), a developing region (FIGS. 5, 6) in which the powder material is applied to the substrates, a fusing region (FIG. 7) in which the applied powder material is fused, and an unloading region (FIG. 8) in which substrates are removed from the platens (202, 203).
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