Cooling Device for Light Emitting Diode (LED) Module and Method for Fabricating the Same
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United States of America Patent
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Issued Date -
Jan 24, 2008
app pub date -
Mar 14, 2007
filing date -
Jul 19, 2006
priority date (Note) -
Abandoned
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Abstract
A cooling device of a light emitting diode module and a method for fabricating the same are disclosed. According to the cooling device for a light emitting diode module of the present invention, the thickness of the whole module is reduced, a thermal resistance is small since a final heat-releasing path from a heat source is shortened, it is easy to release heat, and processing efficiency is high and manufacturing cost is low because a bending process of a lead frame is removed.
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