Use of Partially Saponified Vinly Ester Polymers in Hot-Melt Adhesive Compositions
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United States of America Patent
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Issued Date -
Jan 24, 2008
app pub date -
Feb 10, 2005
filing date -
Feb 12, 2004
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Abstract
Hot melt adhesives with good flow characteristics, resistance to gelling at elevated temperature, strong adhesion, and yet which can be easily removed from substrates with water, are formulated with one or more partially saponified vinyl ester homo- or copolymers having a molecular weight below 70,000 Da, a degree of hydrolysis of from 62 to 86 mol %, the adhesives being free of mannitol and anionic surfactants.
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