Method for fabricating multi-layered flexible printed circuit board without via holes
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United States of America Patent
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Issued Date -
Jan 10, 2008
app pub date -
Jul 5, 2006
filing date -
Jul 5, 2006
priority date (Note) -
Abandoned
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Abstract
A method for fabricating a multi-layered flexible printed circuit board without via holes is disclosed herein, which includes the steps of: providing a flexible printed circuit board formed with a circuit thereon in advance; and fan-folding or rolling the flexible printed circuit board to build up a plurality of layers in order to obtain the multi-layered flexible printed circuit board without via holes; thereby being capable of solving the problems resulting from the via holes formed on a conventional flexible printed circuit board.
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