Optoelectronic device
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United States of America Patent
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Issued Date -
Jan 3, 2008
app pub date -
Jun 28, 2006
filing date -
Jun 28, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention provides an optoelectronic device comprising a light emitting semiconductor and an encapsulant. The encapsulant is made from an encapsulant formulation comprising an epoxy compound and a silicone anhydride such as Formula (D-1) compound. The present invention also provides a method of preparing such optoelectronic device.
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