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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TOHO KOKI CO LTD	NARA 639-1042

International Classification(s)

• B26D:CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, ....
• B26B:HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR....

• 2006 Application Filing Year
• B26D Class
• 305 Applications Filed
• 104 Patents Issued To-Date
• 34.10 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Eriguchi, Tatsumi	Nara, JP	1	15
# of filed Patents : 1 Total Citations : 15

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Patent Citation Ranking

• 15 Citation Count
• B26D Class

• 75.45 % this patent is cited more than
• 17 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2012/0129,336

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

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Abstract

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Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a trench formed in a dielectric layer which has at least a portion thereof devoid of a fluorine boundary layer. The structure further includes a copper wire in the trench having at least a bottom portion thereof in contact with the non-fluoride boundary layer of the trench. A lead free solder bump is in electrical contact with the copper wire.

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