SOLDER-RESISTANT FLEXIBLE THERMOSETTING EPOXY RESIN SYSTEM
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United States of America Patent
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Issued Date -
Dec 27, 2007
app pub date -
Jun 22, 2006
filing date -
Jun 22, 2006
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Abstract
A thermosetting epoxy resin composition with improved flexibility, adhesion and solder resistance includes (a) 40-100 phr (parts per hundred parts) of dimmer acid modified epoxy resin; (b) 0-60 phr of an additive epoxy resin for adjusting softness; (c) 1-30 phr of a hardening agent; and (d) 0.1-10 phr of a catalyst.
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