Phenyl-containing silicone epoxy formulations useful as encapsulants for LED applications

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20070299165A1
SERIAL NO

11475804

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Abstract

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An encapsulant composition is provided. The composition includes an epoxy composition including at least a silicone and a phenyl group, a curing agent, and a filler.

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Patent Owner(s)

Patent OwnerAddress
GELCORE LLC6180 HALLE DRIVE VALLEY VIEW OH 44125-4635

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haitko, Deborah Ann Schenectady, NY 37 316
Rubinsztajn, Slawomir Ballston Spa, NY 87 1013

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