Dicing and Packing Metod of Sheet-Like Wafer, Packed Product of Water, and Separation Jig
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United States of America Patent
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N/A
Issued Date -
Dec 27, 2007
app pub date -
Aug 30, 2005
filing date -
Aug 30, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
To provide a dicing and packing method of a sheet-like wafer that can collectively solve conventional problems such as damage of an individual piece, generation of dusts, and increase of troublesome work at a time of packing, caused in a process of packing the individual pieces obtained by dicing a wafer with a large area, and a packed product of a wafer. The method includes a dicing step of, in a state in which a dicing tape 2 has been adhered on one face of a cleaned wafer 1, dicing the wafer into individual pieces from the other face thereof, a thermal separation tape adhering step of adhering a thermal separation tape 3 on the other face of the wafer, a dicing tape peeling step, a heating step of heating the thermal separation tape to decrease an adhesive force thereof, a first protective sheet tape adhering step of adhering a first protective sheet tape 4 on one face of the wafer, a thermal separation tape peeling step, an appearance inspecting step of performing appearance inspection from the other face of the wafer, and a second protective sheet tape adhering step of adhering a second protective sheet tape 5 on the other face of the wafer which has been completed to the appearance inspecting step.
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