Encapsulated optoelectronic device
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United States of America Patent
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Issued Date -
Dec 27, 2007
app pub date -
Jun 27, 2006
filing date -
Jun 27, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention provides a method of integrating an encapsulant into an optoelectronic device, comprising: (a) contacting the optoelectronic device to be encapsulated with an adhesion promoter composition comprising an epoxy-functional silane and an amino-functional silane; and (b) applying an encapsulant formulation onto the optoelectronic device that has been treated with the adhesion promoter composition. Also provided is optoelectronic device such as LED device made using the method.
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