Optoelectronic device
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United States of America Patent
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Issued Date -
Dec 27, 2007
app pub date -
Jun 27, 2006
filing date -
Jun 27, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention provides an optoelectronic device comprising a light emitting semiconductor and an encapsulant. The encapsulant is made from an encapsulant formulation comprising an epoxy hydantoin, an epoxy isocyanurate, and a curing agent. The present invention also provides a method of preparing such optoelectronic device.
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