Flat Type Heat Transferring Device and Manufacturing Method of the Same
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United States of America Patent
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Issued Date -
Dec 27, 2007
app pub date -
Jun 26, 2007
filing date -
Jun 26, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a flat type heat transferring device, and manufacturing method of the same, which is comprises of a capillary wick that is provided inside a case and formed by weaving a wire in the horizontal direction and the vertical direction so as to absorb a liquid coolant, and a linear member that is formed to have a different wire diameter from the wire of the capillary wick and woven in the capillary wick to form a space where a vapor coolant flows. Accordingly, the mechanically stabilized support rigidity can be secured and an ultra thin configuration can be implemented with a light-weight, in particular, the problem of degrading the capillary force is resolved, and it has the effect that the cooling efficiency can be improved with smooth flowing of a coolant.
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