Positive Photosenstive Composition
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United States of America Patent
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Issued Date -
Dec 20, 2007
app pub date -
Jul 12, 2005
filing date -
Jul 12, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
There is provided a positive photosensitive composition which requires no burning, makes it possible to obtain necessary and sufficient adhesion when it is applied under a humidity of 25 to 60%, can be developed at a low alkali intensity, makes it possible to carry out development with keeping high sensitivity while forming no residue, ensures sharp edges, can provide a very hard resist film and is improved in scratch resistance in the handling before development. The composition comprises (A) an alkali-soluble high molecular substance having in the molecule thereof at least one carboxyl group, (B) a photo-thermal conversion material which absorbs infrared rays from an image exposure light source to convert the rays to heat, and (C) a thiol compound.
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