LIGHT EMITTING DIODE AND MANUFACTURING METHOD OF THE SAME
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United States of America Patent
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Issued Date -
Dec 20, 2007
app pub date -
May 15, 2007
filing date -
Jun 16, 2006
priority date (Note) -
Abandoned
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Abstract
A light emitting diode includes a permanent substrate having a first portion and a second portion, and a chip attached on the first portion of the permanent substrate by a chip bonding technology. The chip includes at least one first electrode and a light emitting region. The manufacturing method comprises a step of mounting a single chip on the first portion of the permanent substrate by a chip bonding technology to overcome the fragility problem of an EPI-wafer.
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