Device, System and Method for Cutting, Cleaving or Separating a Substrate Material
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
N/A
app pub date -
Jun 20, 2005
filing date -
Jun 21, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An apparatus and method for separating a nonmetallic substrate is disclosed as including a first beam; a first quenching device positioned so that a coolant stream may be applied to the substrate at or immediately adjacent to the trailing end of the first spot; a second beam; and a second quenching device positioned between the first quenching device and the second beam. At least one of an angle at which the first scribe beam impinges on the substrate and an energy intensity of the first scribe beam impinging on the substrate are adjusted to obtain right angle separation. A crack sensor and controller can also be provided for measuring a position of the cut line, comparing the position with a reference position and adjusting the power intensity of the second beam based on the comparison of the position of the cut line with the reference position.
First Claim
Other Claims data not available