INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
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United States of America Patent
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N/A
Issued Date -
Dec 13, 2007
app pub date -
Jun 13, 2006
filing date -
Jun 13, 2006
priority date (Note) -
Abandoned
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Abstract
A method for coupling a semiconductor substrate to a receiving substrate is disclosed. The method comprising the step of providing a receiving substrate having at least one receiving pad formed thereon, the at least one receiving pad having a face and a portion substantially extending from the periphery of the face to the receiving substrate. The method also involves the step of providing a semiconductor substrate having at least one bonding pad formed thereon and at least one pillar extending from the at least one bonding pad towards the at least one receiving pad, the at least one pillar having a reflowable and a non-reflowable portion. The method further involves the step of positioning the semiconductor substrate over the receiving substrate for facing the at least one receiving pad towards the at least one pillar, and reflowing the reflowable portion substantially over the face and substantially onto the portion.
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