EMI/RFI FINGER CLIP GASKET
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United States of America Patent
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-
N/A
Issued Date -
Dec 13, 2007
app pub date -
Jun 8, 2006
filing date -
Jun 8, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An elongated EMI/RFI grounding and shielding structure is formed from a resiliently deflectable, electrically conductive material and has a longitudinally spaced series of specially configured finger sections interdigitated with spring sections. Each finger structure has a domed central body portion, a first end portion with an inwardly curved, generally hook-shaped configuration, and an opposite second end portion having a generally planar outer flange end portion extending outwardly from the body and being offset therefrom by a transverse jog section. The grounding structure is operatively attached to and captively retained on an electrically conductive wall, such as a wall of an electronic component housing, by inserting the first and second finger end portions respectively into spaced series of first and second cutout openings in the wall.
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