FRONT-END PROCESSED WAFER HAVING THROUGH-CHIP CONNECTIONS
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United States of America Patent
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app pub date -
Dec 29, 2006
filing date -
Jun 6, 2006
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Abandoned
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Abstract
A method involves forming vias in a blank semiconductor wafer, making at least some of the vias in the blank semiconductor wafer electrically conductive, and performing front end processing on the blank wafer so as to create devices on the wafer that are connected to the electrically conductive vias.
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