Metal-binding motif compositions and methods
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United States of America Patent
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Feb 9, 2010
Grant Date -
Dec 6, 2007
app pub date -
May 30, 2006
filing date -
May 30, 2006
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Abstract
Disclosed herein are recombinant copper or zinc binding polypeptides containing at least one copper or zinc binding motif and a sequence heterologous to it. Also disclosed is a method to reduce the concentration of a free copper or zinc ion in a substrate by contacting it with a recombinant polypeptide containing a copper or zinc binding motif. A further method relates to reducing the concentration of a free copper or zinc ion in a substrate by contacting it with a host cell that expresses a recombinant polypeptide containing a copper or zinc binding motif.
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