Method for Production of Electronic and Optoelectronic Circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 6, 2007
app pub date -
Apr 12, 2005
filing date -
Apr 13, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
According to the invention, in an assembly comprising an electronic component (108), said component is connected by microbeads (107) to at least one heat sink (106, 109), said beads being connected to electrically-conductive lines on said electronic component and to electrically-conductive lines on at least one heat sink, said beads carrying, on the one hand, electrical signals between the electronic component and each heat sink bearing said electrically-conductive lines and, on the other hand, the heat from the electronic component to each heat sink, via heat conduction.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully