Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate
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United States of America Patent
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Issued Date -
Nov 22, 2007
app pub date -
Aug 22, 2005
filing date -
Sep 10, 2004
priority date (Note) -
Abandoned
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Abstract
Provided are an electroless plating pretreatment liquid used in a copper-clad laminate for a flexible substrate whose initial adhesive force between the substrate material and copper plating layer in an ordinary state as well as the adhesive force in a peel test after aging (in the atmosphere at 150.degree. C. for 168 hours) are at least 0.4 kgf/cm, and a copper-clad laminate for a flexible substrate produced using same. The electroless plating pretreatment agent used in a substrate material of a copper-clad laminate for a flexible substrate comprising a thermoset resin and a silane coupling agent having a metal capturing capability. The copper-clad laminate for a flexible substrate wherein a substrate material is treated with the electroless plating pretreatment agent, a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.
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