WIRE BONDING PROCESS FOR INSULATED WIRES
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United States of America Patent
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-
N/A
Issued Date -
Nov 15, 2007
app pub date -
May 4, 2007
filing date -
May 9, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-off device to melt the tip of the insulated wire and produce a pilot ball. The electric discharge is then terminated. A second electric discharge is then generated to produce the conforming free air ball, and thereafter, the conforming free air ball is attached to a bonding surface to create the ball bond.
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