Positive Photosensitive Composition
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United States of America Patent
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Issued Date -
Nov 8, 2007
app pub date -
Oct 25, 2005
filing date -
Nov 30, 2004
priority date (Note) -
Abandoned
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Abstract
Provided is a positive photosensitive composition excellent in an etching factor and adhesion. The composition includes: (A) an alkali-soluble high molecular substance having in the molecule thereof at least one carboxyl group, (B) a photo-thermal conversion material which absorbs infrared rays from an image exposure light source to convert the rays to heat, and (C) a silane coupling agent. The silane coupling agent (C) is preferably a silane coupling agent having an alkoxysilyl group and at least one functional group selected from the group consisting of imidazole, vinyl, epoxy, methacryloxy, acryloxy, amino, mercapto, isocyanate, styryl, and polysulfide groups.
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