Flexible printed circuit board substrate
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United States of America Patent
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N/A
Issued Date -
Nov 8, 2007
app pub date -
Aug 28, 2006
filing date -
May 2, 2006
priority date (Note) -
Abandoned
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Abstract
A flexible printed circuit board substrate comprising a conductive layer and a support layer bonded to the conductive layer, in which the support layer comprises a metal layer for structural support, an adhesive layer formed on one side of the metal layer for bonding the metal layer to the conductive layer, and a protective layer formed on the other side of the metal layer. The flexible printed circuit board substrate according to the present invention can avoid the problem of substrate warpage caused by dimension variations frequently encountered by a conventional flexible printed circuit board substrate.
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