DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Nov 8, 2007
app pub date -
May 3, 2007
filing date -
May 5, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
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US Family Size
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Non-US Coverage
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Abstract
A high voltage semiconductor module has a leadframe with spaced pads which is connected to a heat sink plate by a curable insulation layer on the top of the plate. Semiconductor die may be soldered to the leadframe pads before or after assembly to the plate. The insulation layer may be a curable epoxy or a B stage IMS plate.
First Claim
Other Claims data not available
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| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| WO | A2 | WO2007130643 | May 04, 2007 |
| JP | A | JP2009536458 | May 04, 2007 |
International Classification(s)
- 2007 Application Filing Year
- H01L Class
- 14819 Applications Filed
- 10455 Patents Issued To-Date
- 70.56 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 17 Citation Count
- H01L Class
- 42.27 % this patent is cited more than
- 18 Age