Scalable liquid cooling system with modular radiators
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United States of America Patent
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Issued Date -
Nov 8, 2007
app pub date -
May 3, 2007
filing date -
May 4, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly configured fluid-to-air heat exchanger, such as a radiator. The air plenum also include one or more air movers for blowing air through the expansion slots, and therefore through any radiators fitted within the expansion slots. For those expansion slots that are not used, a blanking plate is fitted to each unused expansion slot. Each blanking plate is modularly configured in a manner similar to the modularly configured radiators. In this manner, air bypass is substantially prevented. Each radiator is part of an independent cooling loop, used directly or indirectly to cool heat generating devices.
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