Method and apparatus for removing surface mount device from printed circuit board
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United States of America Patent
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N/A
Issued Date -
Nov 1, 2007
app pub date -
Apr 27, 2006
filing date -
Apr 27, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed are various embodiments of, and accompanying methods relating to, one or more weakened zones provided inside a surface mount device perimeter of a printed circuit board. The one or more weakened zones facilitate removal of a surface mount device from the printed circuit board after the surface mount device has been attached to the printed circuit board with an adhesive. The devices and methods disclosed herein may also be employed when the surface mount device has not only been attached to a printed circuit by an adhesive but also by solder connecting the contacts or leads of the surface mount device to corresponding pads located on the printed circuit board.
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