Locally bonding multi-layer arrays
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United States of America Patent
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Issued Date -
Nov 1, 2007
app pub date -
Apr 26, 2006
filing date -
Apr 26, 2006
priority date (Note) -
Abandoned
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Abstract
In the methods described, a treatment method is employed on a flexible substrate forming a multi-layer array. The method includes providing the flexible substrate; placing a material to be treated on a surface of the flexible substrate; and treating the material with a frequency energy.
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