Fluid distribution system
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United States of America Patent
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Issued Date -
Nov 1, 2007
app pub date -
Apr 23, 2007
filing date -
Apr 28, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a method and apparatus for bulk fluid distribution. In particular, the invention provides a method and apparatus for distributing fluids in a semiconductor manufacturing plant (e.g. a 300 mm fab). The invention meets the performance and uptime requirements of semiconductor manufacturers including increased capacity and pressure control as compared to known fluid distribution systems, and can satisfy the requirements of 'no single point failures' and 'no planned downtime.'
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