Transparent polyamide molding compositions
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United States of America Patent
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Issued Date -
Oct 25, 2007
app pub date -
Apr 20, 2007
filing date -
Apr 21, 2006
priority date (Note) -
Abandoned
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Abstract
A polyamide molding composition is described, comprising at least one transparent homopolyamide and/or copolyamide in a proportion by weight of from 70 to 99% by weight; at least one further polymer in a proportion by weight of from 1 to 30% by weight; and also optionally further dyes and/or additives. The polyamide molding composition is one wherein the further polymer is a polyesteramide, and wherein the light transmittance to ASTM D1003 of a sheet of thickness 2 mm produced from the polyamide molding composition is at least 88%, and preferably wherein the notched impact resistance of an article produced therefrom is at least 14 kJ/m.sup.2.
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