METHOD FOR THE PRODUCTION OF A PRINTED CIRCUIT STRUCTURE AS WELL AS A PRINTED CIRCUIT STRUCTURE THUS PRODUCED
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United States of America Patent
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Issued Date -
Oct 25, 2007
app pub date -
Apr 12, 2007
filing date -
Apr 12, 2006
priority date (Note) -
Abandoned
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Abstract
A method for the production of a carrier material in current-free metallization baths includes first exposing the plate-shaped carrier material to selective electromagnetic radiation of an Nd:YAG laser in order to create printed circuit structures on the carrier material as highly reactive aluminum particles by breaking-up non-conductive aluminum nitride that is extremely finely dispersed in the carrier material. At the same time, nitrogen is released, which prevents an undesired oxidation of the aluminum particles. Subsequently, at least one copper layer is applied current-free onto the printed circuit structure. In addition, a printed circuit structure produced on the carrier material by means of this method.
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