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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
CONTECH CONSTRUCTION PRODUCTS INC	9025 CENTRE POINTE DRIVE SUITE 400 WEST CHESTER OH 45069

International Classification(s)

• B21C:MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PR....

• 2006 Application Filing Year
• B21C Class
• 88 Applications Filed
• 33 Patents Issued To-Date
• 37.50 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Schluter, James C	Franklin, OH	10	176
# of filed Patents : 10 Total Citations : 176
Zepp, William L	Lebanon, OH	8	30
# of filed Patents : 8 Total Citations : 30

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Patent Citation Ranking

• 17 Citation Count
• B21C Class

• 95.45 % this patent is cited more than
• 18 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2013/0065,403

WAFER CARRIER WITH THERMAL FEATURES

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Abstract

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A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with thermal control features such as trenches which form thermal barriers having lower thermal conductivity than surrounding portions of the carrier. These thermal control features promote a more uniform temperature distribution across the wafer surfaces and across the carrier top surface.

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Description

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Claims

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