Electrically conductive resin compounds based on polyoxymethylene and highly structured carbon black
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United States of America Patent
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Jul 8, 2008
Grant Date -
Oct 11, 2007
app pub date -
Mar 30, 2006
filing date -
Mar 30, 2006
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Abstract
This invention in one aspect is a polyoxymethylene compound exhibiting an improved balance of properties and volume resistivity of 10.sup.0-10.sup.6 ohm-cm, which comprises polyoxymethylene, polyethylene glycol, metal oxide, high-structure carbon black and a comb polymer. The invention is more particularly directed to a polyoxymethylene compounds and molded articles therefrom in which the compound comprises 30 to 98.7% by weight of a polyoxymethylene homopolymer or copolymer, from 0.1 to 10% by weight of a polyalkylene glycol, from 0.1 to 10% by weight of metal oxide, from 1% to 15% of a high structured particulate carbon black, and from 0.1 to 15% by weight of a comb polymer containing a relatively less polar backbone with relatively more polar side chains.
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