Air flow diversion device for dissipating heat from electronic components
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United States of America Patent
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N/A
Issued Date -
Oct 11, 2007
app pub date -
Apr 10, 2006
filing date -
Apr 10, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An air flow diversion device for dissipating heat from electronic components, including: an air flow diversion member of predetermined height, wherein two or more left and right airway holes are defined in left and right side walls of the flow diversion member respectively, and a rear side of the flow diversion member is an open space, a connecting portion having a connecting hole is configured on the air flow diversion member, and the connecting portion can be fixedly bolted to a circuit board. An airflow is caused to follow a specific direction and diverted through the left and right airway holes into the open space, thereby enabling a relatively large amount of airflow having relatively high velocity to blow against circumferential surfaces of specific electronic components, thus achieving an efficient reduction in the working temperature of the specific electronic components.
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