Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
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United States of America Patent
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Issued Date -
Oct 11, 2007
app pub date -
Mar 29, 2006
filing date -
Mar 29, 2006
priority date (Note) -
Abandoned
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Abstract
A system and method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an indwelling optical sensor disposed within a polishing pad and data signals are wireless transmitted to a control system.
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