Method and Apparatus for Fray-Free Cutting with Laser Anti-Fray Inducement
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United States of America Patent
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Apr 5, 2007
filing date -
Apr 5, 2006
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Abstract
A method and apparatus for fray-free cutting at the perimeter of an area of a textile sheet on a textile-receiving surface, including creating an anti-fray condition in the sheet along a path at the perimeter by an anti-fray instrument movable along the surface as directed by a controller based on programmed information regarding the perimeter, and cutting the sheet at the perimeter by a cutter movable along the surface as directed by the controller based on the programmed information. The anti-fray instrument is preferably an anti-fray substance applicator or, if the textile is a thermoplastic textile, a laser device configured and arranged to induce an anti-fray state therein.
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