PROCESS AND DEVICE FOR FORM LOCKED JOINING OF TWO COMPONENTS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20070228106A1
SERIAL NO

11747572

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Abstract

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A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.

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Patent Owner(s)

Patent OwnerAddress
LPKF LASER & ELECTRONICS AGOSTERIEDE 7 GARBSEN 30827

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BRUNNECKER, Frank Memmelsdorf, DE 8 51
Hofmann, Alexander Erlangen, DE 73 221

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