Continuous Casting of Copper to Form Sputter Targets
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United States of America Patent
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Issued Date -
Oct 4, 2007
app pub date -
Jun 15, 2005
filing date -
Jun 15, 2004
priority date (Note) -
Abandoned
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Abstract
Continuous casting of copper to produce sputter targets (20). The resulting targets comprise a relatively low amount of inclusions therein and will result in reduced particulate sputtering leading to a more uniform coating that is sputtered onto the desired substrate.
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