Thermopile element and infrared sensor by using the same
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United States of America Patent
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Issued Date -
Oct 4, 2007
app pub date -
Sep 26, 2005
filing date -
Oct 1, 2004
priority date (Note) -
Abandoned
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Abstract
Providing a thermopile element which can follow securely a temperature change of a cold junction of a thermopile according to temperature change of environment, the thermopile element includes a membrane provided on a silicon substrate, a heat sink provided around the membrane, a thermopile structured with a plurality of hot junctions and a plurality of cold junctions arranged on the membrane and on the heat sink, and a thin film thermistor for detecting a temperature of the cold junction received and fixed in a recess formed on the heat sink of the thermopile element.
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