Front and back side dynamically-biased photon emission microscopy
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United States of America Patent
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Issued Date -
Sep 27, 2007
app pub date -
Mar 23, 2006
filing date -
Mar 23, 2006
priority date (Note) -
Abandoned
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Abstract
An apparatus for testing emissions from a packaged integrated circuit is described. The apparatus comprises an ATE for generating input stimulus to said integrated circuit, a universal PEM board. The apparatus further has an electrical connector between said ATE and said universal PEM board and means for wiring the connections from ATE leads to pin leads of said packaged integrated circuit so that the packaged integrated circuit can be biased and stimulated correctly. Jumper wires are provided to allow many to one and one to many connections; and the apparatus includes a photodetector to collect the emitted photons.
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