Structure for stopping mechanical cracks in a substrate wafer, use of the structure and a method for producing the structure
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United States of America Patent
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Issued Date -
Sep 27, 2007
app pub date -
Mar 23, 2006
filing date -
Mar 23, 2006
priority date (Note) -
Abandoned
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Abstract
A structure for stopping mechanical cracks in a substrate wafer used for semiconductor device manufacturing, especially a silicon wafer, is described. The structure includes at least one depression that extends into the substrate wafer for at least 20% of the final thickness of the substrate wafer.
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