LAMINATE FOR HDD SUSPENSION AND PROCESS FOR PRODUCING THE SAME
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United States of America Patent
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Issued Date -
Sep 20, 2007
app pub date -
Mar 31, 2005
filing date -
Mar 31, 2004
priority date (Note) -
Abandoned
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Abstract
The subject of the present invention is to provide a laminate for an HDD suspension which has a thin conductive layer and is free from warpage (camber) or deformation and that in compliance with demands on an HDD suspension for realization of a high density and superfine wiring, ensures high reliability and high precision; and a production process for the same. There is provided a laminate for an HDD suspension containing a stainless layer, polyimide resin layer and conductive layer, wherein a thickness of the conductive layer is 10 .mu.m or less, and in the production process, a laminate containing a stainless layer/polyimide resin layer/conductive layer is produced using the conductive layer having a thickness of larger than 10 .mu.m, and then only the conductive layer is subjected to chemical etching to thereby reduce a thickness of the conductive layer to 10 .mu.m or less.
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